Experimental Investigation of Thin Film InGaAsP Coolers

Most optoelectronic devices for long haul optical communications are based on the InP/InGaAsP family of materials. Thin film coolers based on the same material system can be monolithically integrated with optoelectronic devices such as lasers, switches, and photodetectors to control precisely the device characteristics such as wavelength and optical power. Superlattice structures of InGaAs/InP and InGaAs/InGaAsP are used to optimize the thermionic emission resulting in a cooling behavior beyond what is possible with only the Peltier effect. A careful experimental study of these coolers is undertaken. Mesa sizes, superlattice thickness, and ambient temperature are all varied to determine their effect on cooling performance. A three-dimensional, self-consistent thermal-electric simulation and an effective one-dimensional model are used to understand the experimental observations and to predict what will occur for other untested parameters. The packaging of the coolers is also determined to have consequences in the overall device performance. Cooling on the order of 1 to 2.3 degrees over 1-micron thick barriers is reported.